Concave reflector for complementary metal oxide semiconductor image sensor (cis)

ABSTRACT

In some embodiments, the present disclosure relates to an integrated chip having an inter-layer dielectric (ILD) structure along a first surface of a substrate having a photodetector. An etch stop layer is over the ILD structure, and a reflector is surrounded by the etch stop layer and the ILD structure. The reflector has a curved surface facing the substrate at a location directly over the photodetector. The curved surface is coupled between a first sidewall and a second sidewall of the reflector. The reflector has larger thicknesses along the first sidewall and the second sidewall than at a center of the reflector between the first sidewall and the second sidewall.

REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of U.S. application Ser. No.15/935,341, filed on Mar. 26, 2018, which claims the benefit of U.S.Provisional Application No. 62/546,889, filed on Aug. 17, 2017. Thecontents of the above-referenced Patent Applications are herebyincorporated by reference in their entirety.

BACKGROUND

Many modern day electronic devices comprise image sensors that convertoptical images to digital data representing the optical images. One typeof image sensor commonly used in electronic devices is a backsideillumination (BSI) image sensor. A BSI image sensor comprises an arrayof photodetectors overlying an interconnect structure and configured toreceive radiation on an opposite side from the interconnect structure.This arrangement allows radiation to impinge on the photodetectorsunobstructed by conductive features in the interconnect structure, suchthat the BSI image sensor has high sensitivity to incident radiation.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates a cross-sectional view of some embodiments of abackside illuminated (BSI) image sensor with a reflector having a curvedsurface.

FIGS. 2A-2D illustrates cross-sectional views of some alternativeembodiments of the reflector of FIG. 1.

FIG. 3 illustrates a cross-sectional view of more detailed embodimentsof the BSI image sensor of FIG. 1.

FIG. 4 illustrates a circuit diagram of some embodiments of a pixelsensor in the BSI image sensor.

FIG. 5 illustrates a top view of some embodiments of the BSI imagesensor of FIG. 1.

FIGS. 6-15 illustrate a series of cross-sectional views of variousembodiments of a method for manufacturing a BSI image sensor with areflector having a curved surface.

FIG. 16 illustrates a method for manufacturing a BSI image sensor with areflector corresponding to FIGS. 6-15.

DETAILED DESCRIPTION

The present disclosure provides many different embodiments, or examples,for implementing different features of this disclosure. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Typically, backside illuminated (BSI) image sensors comprise an array ofphotodetectors arranged within a substrate. An interconnect structure isarranged along a first side of the substrate. The interconnect structurecomprises a plurality of conductive interconnect features surrounded bya dielectric structure having one or more inter-level dielectric layers.The array of photodetectors are configured to receive radiation (e.g.,photons) from a second side of the substrate opposite the first side.Because the substrate receives radiation on a side not covered by theinterconnect structure, paths of radiation incident on BSI image sensorsare not obstructed by the interconnect structure and thus the BSI imagesensors are able to provide for a good quantum efficiency.

To further increase a quantum efficiency of a BSI image sensor, planarconductive features may be formed within the interconnect structure at alocation underlying the array of photodetectors. The planar conductivefeatures are configured to increase the quantum efficiency of thephotodetectors by reflecting radiation that passes through thephotodetector back to the photodetector, thereby providing thephotodetectors with two opportunities to absorb the radiation. However,since incident radiation travels along substantially straight lines,angled radiation may diverge away from an overlying photodetector due toa gap between the photodetector and an underlying planar conductivefeature. For example, radiation with a low angle of incidence may strikea planar conductive feature and diverge through a gap to neighboringpixel sensors and induce crosstalk.

The present application, in some embodiments, relates to a back-sideilluminated complementary metal oxide semiconductor image sensor(BSI-CIS) having a curved reflector configured to provide for a highquantum efficiency and low crosstalk, and an associated method offormation. In some embodiments, the BSI-CIS comprises a photodetectordisposed within a substrate. An interconnect structure is arrangedwithin a dielectric structure arranged along a first side of thesubstrate. The interconnect structure comprises a contact via extendingfrom an interconnect wire layer to a transistor coupled to thephotodetector. A concave reflector is arranged within the dielectricstructure. The concave reflector has a curved profile with edges thatare closer to the substrate than a center. The curved profile isconfigured to reflect incident radiation towards a focal point that iswithin or above the photodetector, and thereby prevents the incidentradiation from reflecting to adjacent photodetectors.

With reference to FIG. 1, a cross-sectional view of some embodiments ofan integrated chip having a complementary metal oxide semiconductorimage sensor (CIS) 100 including a reflector 102 is provided. Here, theCIS 100 is shown as a backside illuminated (BSI) image sensor. Asillustrated, the reflector 102 is arranged under a photodetector 104disposed in a substrate 110. In some embodiments, the photodetector 104may comprise a photodiode of a pixel sensor 106. The photodetector 104is configured to absorb radiation 108 impinging thereon. In someembodiments, the radiation 108 passes through the photodetector 104 andcontacts the reflector 102. The reflector 102 comprises a reflectivematerial, such as a metal. The reflector 102 is configured to reflectthe radiation 108 that passes through the photodetector 104 back to thephotodetector 104.

The substrate 110 has a first surface 110 a and a second surface 110 b.The radiation 108 enters the second surface 110 b to reach thephotodetector 104. In the some embodiments, the photodetector 104extends into the substrate 110 from the first surface 110 a. Aninterconnect structure 112 is arranged along the first surface 110 a ofthe substrate 110. The interconnect structure 112 includes a dielectricstructure 114 surrounding a conductive interconnect wire 116, aconductive contact 118, and the reflector 102. The conductiveinterconnect wire 116 is electrically coupled to the pixel sensor 106 bythe conductive contact 118. The reflector 102 is separated from thesecond surface 110 b of the substrate 110 by a gap 120.

The reflector 102 has an upper surface 122 facing the substrate 110. Theupper surface 122 is concave. In some embodiments, the upper surface 122is defined by a continuous function (i.e., a function differentiable ateach point along the upper surface 122). In other embodiments, the uppersurface 122 is defined by a non-continuous function (i.e., a functionnot differentiable at each point along the upper surface 122). Thereflector 102 may also have a lower surface 124 that is substantiallyplanar. The upper surface 122 and the lower surface 124 extend laterallybetween opposing sides of the photodetector 104 and, in someembodiments, have a same footprint. The footprint is a two-dimensionalprojection of the upper surface 122 or the lower surface 124 onto ahorizontal plane.

In some embodiments, the reflector 102 is substantially symmetricalabout a central axis C that is arranged at a midpoint of a width W ofthe reflector 102. Further, in some embodiments, a thickness T of thereflector 102 increases from the central axis C moving laterally towardan edge of the reflector 102. In some embodiments, the thickness T ofthe reflector 102 may monotonically increase from the central axis Ctoward an edge of the reflector 102.

By arranging the reflector 102 directly under the photodetector 104,radiation 108 passing through the photodetector 104 may be reflectedback to the photodetector 104. Further, by configuring the upper surface122 of the reflector 102 with a concave profile, the radiation 108 isfocused to a focal point that is within or directly above thephotodetector 104, thereby preventing radiation from diverging away fromthe photodetector 104 due to the gap 120. For example, the concaveprofile of the reflector 102 will reflect radiation 108 impinging thereflector 102 at a small angle of incidence back towards thephotodetector 104, thereby reducing the amount of radiation able toescape through the gap 120. In some embodiments, the focal point may beat the intersection of the central axis C and a focal plane 126extending laterally through the photodetector 104.

In some embodiments, the pixel sensor 106 further comprises a floatingdiffusion node (FDN) 128 and a transfer transistor 130. The FDN 128 isconfigured to store charge transferred thereto from the photodetector104, and the transfer transistor 130 is configured to selectivelytransfer the charge to the FDN 128. The FDN 128 is arranged in thesubstrate 110. The FDN 128 includes a doped semiconductor region ofopposite doping type as a surrounding region of the substrate 110. Thetransfer transistor 130 comprises a gate electrode 132 arranged on thesubstrate 110, laterally adjacent to the photodetector 104, and spacedfrom the substrate 110 by a gate dielectric layer 134. Further, thetransfer transistor 130 comprises source/drain regions arranged in thesubstrate 110, respectively on opposing sides of the gate electrode 132,to define a channel region 136 over the gate electrode 132. In someembodiments, one of the source/drain regions is the photodetector 104,and/or one of the source/drain regions is the FDN 128. In someembodiments, the conductive contact 118 extends to the gate electrode132 of the transfer transistor 130.

With reference to FIGS. 2A-2D, cross-sectional views 200A-200D of somealternative embodiments of the reflector 102 of FIG. 1 are provided. Asillustrated by the cross-sectional view 200A of FIG. 2A, the reflector102 may comprise a first segment 202 and a second segment 204 arrangedalong a photodetector 104 (e.g., a photodiode). In some embodiments, thefirst segment 202 may be separated from the second segment 204 by thedielectric structure 114. In other embodiments (not shown), thereflector 102 is continuous between the first segment 202 and the secondsegment 204. The first segment 202 and the second segment 204 maycomprise for example, copper, titanium, chromium, niobium, lead,palladium, gold, silver, aluminum, aluminum copper, tungsten, or someother reflective material. In some embodiments, the first segment 202and the second segment 204 may comprise different materials. In otherembodiments, the first segment 202 and the second segment 204 maycomprise a same material.

The first segment 202 is arranged under the photodetector 104 in theinterconnect structure 112. In some embodiments, the first segment 202extends laterally from a first side of the photodetector 104, towards asecond side of the photodetector 104 that opposes the first side. Insome embodiments, the first segment 202 has an upper surface 122 that isconcave and a lower surface 124 that is planar. The second segment 204has a first side 206 that is proximate to the photodetector 104 and asecond side 208 that is opposite the first side 206. An isolation region210 extends into the substrate 110 from the second surface 110 b of thesubstrate 110. The second segment 204 is arranged over or adjacent tothe first segment 202, within the isolation region 210.

By arranging the first segment 202 under the photodetector 104,radiation 108 passing through the photodetector 104 may be reflectedback to the photodetector 104. Further, by arranging the second segment204 laterally adjacent to the photodetector 104, the radiation 108 maybe prevented from reflecting towards a neighboring pixel sensor (notshown). For example, radiation 108 reflecting off the first segment 202towards the neighboring pixel sensor (not shown), will subsequently bereflected off the second segment 204 back towards the photodetector 104.

As illustrated by the cross-sectional view 200B of FIG. 2B, thereflector 102 may have an upper surface 212 that is concave and a lowersurface 214 that is convex. The upper surface 212 and the lower surface214 extend laterally between opposing sides of a photodetector 104 and,in some embodiments, have the same footprint.

As illustrated by the cross-sectional view 200C of FIG. 2C, thereflector 102 may have an upper surface 222 opposing a lower surface 224that is planar. The upper surface 222 has a central region 226 that isbounded by a first protrusion 228 on the first side and a secondprotrusion 230 on the second side. The central region 226 has a firstcurvature with a slope that is smaller than a slope of sidewalls of thefirst protrusion 228 and the second protrusion 230 that face each other.In some embodiments, the central region 226 may have a curved surfaceextending from the first protrusion 228 to the second protrusion 230. Inother embodiments, the central region 226 may have a generally planarsurface extending from the first protrusion 228 to the second protrusion230. The first protrusion 228 and the second protrusion 230 may extendvertically upward at a protrusion angle 234 relative to the centralregion 226. The protrusion angle 234 may be an obtuse angle in a rangeof between approximately 100° and approximately 125°. In someembodiments, the first protrusion 228 and the second protrusion 230 cometo points at apexes extending along a horizontal plane 232 over theupper surface 222 of the reflector 102.

As illustrated by the cross-sectional view 200D of FIG. 2D, thereflector 102 may have outer sidewalls with an outer sidewall angle 236relative to the planar bottom surface 124 of the reflector 102. Theouter sidewall angle 236 may be an angle in a range of betweenapproximately 60° and approximately 85°. In some embodiments, the outersidewalls of the reflector 102 are angled so a lower surface 124 of thereflector 102 facing away from the substrate 110 has a larger width thanan upper surface 122 of the reflector 102 facing the substrate 110.

In some embodiments, both the upper surface 122 of the reflector 102 andlower surface 124 of the reflector 102 may comprise concave surfaces. Insome such embodiments, the upper surface 122 of the reflector 102 mayhave a first curvature defined by a first change in vertical position238 between an outer edge and a center of the reflector 102, and thelower surface 124 of the reflector 102 may have a second curvaturedefined by a second change in vertical position 240 between an outeredge and a center of the reflector 102. In some embodiments, the firstchange in vertical position 238 is larger than the second change invertical position 240.

With reference to FIG. 3, a cross-sectional view of some more detailedembodiments of the BSI image sensor 300 of FIG. 1 is provided. Asillustrated, isolation regions 302 are arranged within a first surface110 a of the substrate 110. The isolation regions 302 are arranged onopposing sides of a pixel sensor 106. The isolation regions 302 areconfigured to electrically and/or to optically isolate the pixel sensor106 from a neighboring pixel sensor (not shown). The isolation regions302 may be, for example, a shallow trench isolation (STI) region, animplant isolation region, and/or a deep trench isolation (DTI) region.

The pixel sensor 106 comprises a photodetector 104 and a transistor gatestack. In some embodiments, the transistor gate stack is disposedbetween the photodetector 104 and a FDN 128. The photodetector 104 andthe FDN 128 are arranged in the substrate 110, and are dopedsemiconductor regions of opposite doping type (n-type or p-type) asrespective regions of the substrate 110 that surround the dopedsemiconductor regions. The photodetector 104 is configured to generateand store charge in response to incident radiation, and the FDN 128 isconfigured to store charge transferred thereto from the photodetector104. In some embodiments, the photodetector 104 and/or the FDN 128 havelateral extensions of reduced depth and/or concentration as respectivebulks of the photodetector 104 (e.g., photodetector) and/or the FDN 128.

The transfer transistor 130 is configured to transfer charge accumulatedin the photodetector 104 to the FDN 128. The transfer transistor 130comprises a gate electrode 132 arranged on the substrate 110, laterallyadjacent to the photodetector 104. The gate electrode 132 is spaced fromthe substrate 110 by a gate dielectric layer 134 and, in someembodiments, has sidewall surfaces lined by a sidewall spacer 304. Thegate electrode 132 may be, for example, metal, doped polysilicon, orsome other conductive material. The gate dielectric layer 134 may be,for example, silicon dioxide, a high κ dielectric (i.e., a dielectricwith a dielectric constant κ exceeding about 3.9), or some otherdielectric material. The sidewall spacer 304 may be, for example,silicon nitride, silicon oxynitride, or some other dielectric material.

The transfer transistor 130 further comprises source/drain regionsarranged in the substrate 110, respectively on opposing sides of thegate electrode 132, to define a channel region 136 over the gateelectrode 132 that selectively conducts depending upon a bias applied tothe gate electrode 132. The source/drain regions are doped semiconductorregions of opposite doping type as respective regions of the substrate110 that surround the doped semiconductor regions. In some embodiments,one of the source/drain regions is the photodetector 104, and/or one ofthe source/drain regions is the FDN 128.

An interconnect structure 112 is arranged along the first surface 110 aof the substrate 110. The interconnect structure 112 comprises aninter-layer dielectric (ILD) structure 312. In some embodiments, the ILDstructure 312 comprises a first ILD layer 314 and a second ILD layer 316directly contacting a horizontally extending surface of the first ILDlayer 314. In some embodiments, the ILD structure 312 may be separatedfrom the substrate 110 by one or more of a TEOS (tetraethylorthosilicate) layer 306, a resist protective oxide (RPO) layer 308,and/or a contact etch stop layer 310. The interconnect structure 112further comprises alternating layers of etch stop layers (ESLs) 318a-318 c and inter-metal dielectric (IMD) layers 320 a-320 c separatedfrom the substrate 110 by the ILD structure 312. In some embodiments,the IMD layers 320 a-320 c may be, for example, silicon dioxide, a low κdielectric (i.e., a dielectric with a dielectric constant κ less thanabout 3.9), phosphosilicate glass (PSG), some other dielectric, or acombination of the foregoing. In some embodiments, the ESLs 318 a-318 cmay comprise a nitride, a carbide, or the like.

A plurality of conductive interconnect layers are arranged within theinterconnect structure 112. The plurality of conductive interconnectlayers comprise alternating layers of conductive interconnect wires 322a-322 c and conductive vias 324 a-324 b. In some embodiments,thicknesses of the conductive interconnect wires 322 a-322 c increase asa distance from the substrate 110 increases. For example, a secondinterconnect wire 322 b may have a first thickness T₁ that is smallerthan a second thickness T₂ of a third interconnect wire 322 c. Further,a first conductive interconnect wire 322 a closest to the substrate 110is electrically coupled to the pixel sensor 106 by a conductive contact118. In various embodiments, the conductive contact 118, the conductiveinterconnect wires 322 a-322 c, and the conductive vias 324 a-324 b maycomprise, for example, a metal, such as copper, titanium, chromium,niobium, lead, palladium, gold, silver, aluminum, tungsten, or someother conductive material.

A reflector 102 is also arranged within the interconnect structure 112.The reflector 102 vertically extends from within the first ESL 318 a towithin the ILD structure 312, so that the reflector 102 is laterallyseparated from the conductive contact 118 by the ILD structure 312. Insome embodiments, the reflector 102 may contact the first ESL 318 aalong multiple surfaces. For example, the reflector 102 may havesidewalls that contact sidewalls of the first ESL 318 a and ahorizontally extending bottom surface, facing away from the substrate110, which contacts the first ESL 318 a. In some embodiments (notshown), the reflector 102 has a point closest to the substrate 110,which is separated from the first ILD layer 314 by the second ILD layer316. In other embodiments, the reflector 102 extends through the secondILD layer 316 and into the first ILD layer 314. In some embodiments, afirst horizontal line, which is parallel to the second surface 110 b ofthe substrate 110 extends through the reflector 102 and the conductivecontact 118. In some embodiments, a second horizontal line, which isparallel to the second surface 110 b of the substrate 110 extendsthrough the reflector 102 and the first conductive interconnect wire 322a.

In some embodiments, a support device 326 is affixed to the substrate110 through the interconnect structure 112. The support device 326 maybe, for example, a bulk substrate or an IC chip. In some embodiments,the IC chip is electrically coupled to the pixel sensor 106 through theinterconnect structure 112. The IC chip may, for example, comprise anadditional semiconductor substrate (not shown) and an additionalinterconnect structure (not shown) arranged over the additionalsemiconductor substrate.

A passivation layer 328 is arranged along a second surface 110 b of thesubstrate 110. The passivation layer 328 comprises a well filled with acolor filter 330 and covered by a micro-lens 332. The passivation layer328 may be, for example, a multilayer stack of dielectric layers, suchas, for example, a nitride layer stacked between a pair of oxide layers.The color filter 330 is configured to selectively transmit an assignedcolor or wavelengths of radiation to the pixel sensor 106, and themicro-lens 332 is configured to focus incident radiation onto the colorfilter 330 and/or the pixel sensor 106.

With reference to FIG. 4, a circuit diagram 400 of some embodiments ofthe pixel sensor 106 in the BSI image sensor of FIG. 1 is provided. Asillustrated, a FDN 128 is selectively coupled to a photodetector 104 bya transfer transistor 130, and is selectively coupled to a power source402 by a reset transistor 404. The photodetector 104 may be, forexample, a photodiode, and/or the power source 402 may be, for example,a direct current (DC) power source. The transfer transistor 130 isconfigured to transfer charge accumulated in the photodetector 104 tothe FDN 128, and the reset transistor 404 is configured to clear chargestored at the FDN 128. The FDN 128 gates a source follower transistor406 that selectively couples the power source 402 to a row selecttransistor 408, and the row select transistor 408 selectively couplesthe source follower transistor 406 to an output 410. The source followtransistor 406 is configured to non-destructively read and amplifycharge stored in the FDN 128, and the row select transistor 408 isconfigured to select the pixel sensor 106 for readout.

While the pixel sensor 106 in the BSI image sensor of FIG. 1 isdescribed as a five transistor (5T) APS within FIG. 4, it is to beappreciated that other embodiments of the pixel sensor 106 may includemore or less transistors. For example, other embodiments of the pixelsensor 106 may include two, three, or six transistors.

With reference to FIG. 5, a top view 500 of some embodiments of the BSIimage sensor of FIG. 1 is provided. As illustrated, a logic region 502of the BSI image sensor laterally surrounds an isolation region 210within which an array of pixel sensors 106, 504, 506 are arranged. Thelogic region 502 comprises, for example, logic and/or memory devices(not shown) configured to read and/or store data generated by the pixelsensors 106, 504, 506 in response to incident radiation. The isolationregion 210 is configured to isolate the pixel sensors 106, 504, 506 andis, for example, an STI region.

The pixel sensors 106, 504, 506 are assigned respective wavelengths ofradiation. In some embodiments, the pixel sensors 106, 504, 506 arealternatingly assigned red wavelengths of radiation (e.g., about 620 toabout 750 nanometers), green wavelengths of radiation (e.g., about 495to about 570 nanometers), and blue wavelengths of radiation (e.g., about450 to about 495 nanometers). For example, pixel sensors 506 labeled “R”are assigned red wavelengths of radiation, pixel sensors 504 labeled “B”are assigned blue wavelengths of radiation, and pixel sensors 106labeled “G” are assigned green wavelengths of radiation. Further, insome embodiments, the pixel sensors 106, 504, 506 alternate between red,green, and blue wavelength assignments according to a Bayer filtermosaic.

The pixel sensors 106, 504, 506 are individually configured according tothe pixel sensor 106 in FIG. 1, 2A-2D, or 3, and comprise individualcolor filters (not shown) configured to filter incident radiationaccording to the assigned wavelengths of radiation. For example, as seenin FIG. 3, a pixel sensor 106 comprises a color filter (330 of FIG. 3)arranged thereover. Further, the pixel sensors 106, 504, 506 compriseindividual photodetectors 104, 508, 510 and individual reflectors 102,512, 514 (shown in phantom) underlying the photodetectors 104, 508, 510.

In some embodiments, the reflectors 102, 512, 514 are differentmaterials depending upon the assigned wavelengths of radiation forrespective pixel sensors 106, 504, 506. The materials of the reflectors102, 512, 514 may, for example, be selected to optimize reflectance ofthe assigned wavelengths of radiation. For example, reflectors 102assigned green wavelengths of radiation may be a first material with ahigh reflectance for the green wavelengths (relative to blue and redwavelengths), reflectors 512 assigned blue wavelengths of radiation maybe a second material with a high reflectance for the blue wavelengths(relative to green and red wavelengths), and reflectors 514 assigned redwavelengths of radiation may be a third material with a high reflectancefor the red wavelengths (relative to green and blue wavelengths).

Further, in some embodiments, the reflectors 102, 512, 514 are laterallyoffset from respective ones of the photodetectors 104, 508, 510 inproportion to a distance from a center of the array and/or in adirection away from the center of the array. The lateral offsets may be,for example, with respect to edges and/or centers of the photodetectors104, 508, 510 and the reflectors 102, 512, 514. In some embodiments, thecenters of the photodetectors 104, 508, 510, the reflectors 102, 512,514, and the array are centroids of respective footprints. A footprintis a two-dimensional projection onto a horizontal plane.

With reference to FIGS. 6-15, a series of cross-sectional views 600-1500of some embodiments of a method for manufacturing a BSI image sensorwith a reflector 102 is provided. Although the cross-sectional views600-1500 shown in FIGS. 6-15 are described with reference to a method,it will be appreciated that the structures shown in FIGS. 6-15 are notlimited to the method but rather may stand alone separate of the method.

As illustrated by the cross-sectional view 600 of FIG. 6, a substrate110 is provided. In various embodiments, the substrate 110 may be anytype of semiconductor body (e.g., silicon, SiGe, SOI, etc.), as well asany other type of semiconductor, epitaxial, dielectric, or metal layers,associated therewith. A photodetector 104 (e.g., a photodiode) and a FDN128 are formed within a pixel sensor 106 of the substrate 110 onopposing sides of a gate dielectric layer 134 and an overlying gateelectrode 132 to form a transfer transistor 130. In some embodiments,the transfer transistor 130 comprises a sidewall spacer 304 liningsidewall surfaces of the gate electrode 132. One or more isolationregion 210 extend into the substrate 110 on opposing sides of the pixelsensor 106.

An ILD structure 312 is formed over a first surface 110 a of thesubstrate 110. In some embodiments, the ILD structure 312 may be formedby a vapor deposition process, such as chemical vapor deposition (CVD)process or physical vapor deposition (PVD) process, or grown by athermal oxidation. In some embodiments, the ILD structure 312 maycomprise a first ILD layer 314 comprising a borophosphosilicate glass(BPSG), a phosphor silicate glass (PSG), or the like. In someembodiments, the ILD structure 312 may further comprise a second ILDlayer 316 contacting the first ILD layer 314. In some embodiments, thesecond ILD layer 316 may comprise an undoped silicate glass (USG).

A conductive contact 118 extends from an upper surface of the ILDstructure 312 to the gate electrode 132 of the transfer transistor 130.The conductive contact 118 comprises a conductive material, such as, forexample, copper, aluminum, tungsten, gold, or some other conductivematerial. In some embodiments, the conductive contact 118 may be formedby selectively etching the ILD structure 312 to form a contact hole andsubsequently depositing a conductive material in to the contact hole. Aplanarization process (e.g., a chemical mechanical planarizationprocess) may be performed after depositing the conductive material intothe contact hole to remove excess conductive material from over the ILDstructure 312.

A lower etch stop layer 602 is formed over the ILD structure 312 and theconductive contact 118. In some embodiments, the lower etch stop layer602 may comprise a nitride (e.g., silicon nitride), a carbide (e.g.,silicon carbide), or the like. In some embodiments, the lower etch stoplayer 602 may be deposited by a vapor deposition process, such aschemical vapor deposition (CVD) process or physical vapor deposition(PVD) process.

A hard mask layer 604 is formed over the lower etch stop layer 602. Insome embodiments, the hard mask layer 604 comprises a nitride (e.g.,silicon oxynitride (SiON), titanium nitride (TiN), etc.), a carbide(e.g., silicon carbide), or the like. In some embodiments, the hard masklayer 604 may be deposited by a vapor deposition process, such aschemical vapor deposition (CVD) process or physical vapor deposition(PVD) process.

As illustrated by the cross-sectional view 700 of FIG. 7, a maskinglayer 702 is formed over the hard mask layer 604. The masking layer 702may be formed by depositing a layer of photosensitive material (e.g., apositive or negative photoresist) over the hard mask layer 604. Thelayer of photosensitive material is selectively exposed toelectromagnetic radiation according to a photomask. The electromagneticradiation modifies a solubility of exposed regions within thephotosensitive material to define soluble regions. The photosensitivematerial is subsequently developed to define an openings 706 within thephotosensitive material by removing the soluble regions.

As illustrated by the cross-sectional view 800 of FIG. 8, a firstetching process is performed on layers underlying the hard mask layer604. The first etching process selectively exposes the layers underlyingthe hard mask layer 604 to one or more etchants 802 according to thehard mask layer 604. The first etching process forms a reflector recess804 that extends through the lower etch stop layer 602 and into the ILDstructure 312. In some embodiments, the first etching process may beconfigured to over etch the lower etch stop layer 602 by a non-zerodistance 806 of between approximately 200-600 angstroms.

The first etching process is configured to form a reflector recess 804that is defined by a horizontally extending non-planar lower surfacethat extends deeper within the ILD structure (i.e., closer to thesubstrate 110) along edges of the reflector recess 804 than at a centerof the reflector recess 804. In some embodiments, the first etchingprocess is configured to form a reflector recess 804 having a curvedlower surface. In some embodiments (not shown), the first etchingprocess is configured to form a reflector recess 804 having a lowersurface with divots along outer edges of the lower surface. In someembodiments, the first etching process may result in the reflectorrecess 804 having sidewalls that are angled at an angle 808. The angle808 may be in a range of between approximately 60° and approximately 80°

In some embodiments, the first etching process may comprise amicrotrenching etch process (e.g., a dry etch process in which the ionto neutral radical flux is large compared to reactive-ion-etching), inwhich etch rates are larger at a base of sidewalls of the hard masklayer 604. The microtrenching etch process results in an etch profileacross the lower surface of the reflector recess 804 that is convexand/or has divots (i.e., vertical protrusions) at the base of thesidewalls of the hard mask layer 604.

The microtrenching etch process may be performed using various etchchemistries. For example, in some embodiments, the microtrenching etchprocess may comprise a dry etching process with an etch chemistrycomprising chlorine and argon. In other embodiments, the microtrenchingetch process may comprise a dry etching process with an etch chemistrycomprising a fluorine species (e.g., hexaflourine) and oxygen. In someembodiments, a taper of the lower surface of the reflector recess 804may be selectively controlled based on a ratio of etching gases used ina dry etching process. For example, the taper of the lower surface maybe based on a ratio of a first etching gas (e.g., oxygen) to secondetching gas (e.g., a fluorine species).

As illustrated by the cross-sectional view 900 of FIG. 9, a reflectivematerial 902 is formed in the reflector recess 804. In some embodiments,the reflective material 902 comprises aluminum, silver, gold, aluminumcopper, copper, and/or some other metal. Furthermore, in someembodiments, the process for forming the reflective material 902comprises depositing or otherwise growing the reflective material 902covering the lower etch stop layer 602 and over-filling the reflectorrecess 804.

As illustrated by the cross-sectional view 1000 of FIG. 10, aplanarization process is performed to form a reflector 102 by removingthe reflective material 902 from over the lower etch stop layer 602. Insome embodiments, the planarization process may comprise a chemicalmechanical planarization (CMP) process. In other embodiments, thereflective material 902 over the hard mask layer (604 of FIG. 9) may beremoved by an etch back process.

As illustrated by the cross-sectional view 1100 of FIG. 11, an upperetch stop layer 1102 is formed over the lower etch stop layer 602 andthe reflector 102. The lower etch stop layer 602 and the upper etch stoplayer 1102 may collectively comprise a first etch stop layer 318 a. Theupper etch stop layer 1102 may comprise a same material or a similar asthe lower etch stop layer 602, and may be, for example, silicon carbideor silicon nitride.

As illustrated by the cross-sectional view 1200 of FIG. 12, a firstinter-metal dielectric (IMD) layer 320 a is formed over the first etchstop layer 318 a. The first IMD layer 320 a may be for example a low-kdielectric (e.g., SiCO), silicon dioxide, PSG, or some other dielectricmaterial.

As illustrated by the cross-sectional view 1300 of FIG. 13, the firstIMD layer 320 a and the first etch stop layer 318 a are selectivelypatterned to form a trench 1302 defining a location of a conductiveinterconnect wire. In some embodiments, first IMD layer 320 a and thefirst etch stop layer 318 a are selectively patterned according to aphotolithography process.

As illustrated by the cross-sectional view 1400 of FIG. 14, a conductivematerial is formed within the trench 1302 to form a conductiveinterconnect wire 116. In various embodiments, the conductive materialmay be formed by way of a deposition process and/or an electro platingprocess. For example, in some embodiments, a conductive seed layer maybe formed within the trench 1302 followed by an electroplating processto fill the trench 1302 with the conductive material. In someembodiments, a barrier layer may be formed within the trench 1302 priorto the formation of the conductive material. In some embodiments, theconductive material may comprise copper and/or aluminum. In someembodiments, the barrier layer may comprise titanium nitride or tantalumnitride, for example. In some embodiments, the conductive interconnectwire 116 may be electrically coupled to the gate electrode 132 by theconductive contact 118.

As illustrated by the cross-sectional view 1500 of FIG. 15, thesemiconductor structure of FIG. 14 is rotated about 180 degrees and apassivation layer 328 is formed on the substrate 110. In someembodiments, the passivation layer 328 is formed of silicon nitride orsilicon dioxide. Further, in some embodiments, the process for formingthe passivation layer 328 comprises depositing or otherwise growing thepassivation layer 328 by, for example, thermal oxidation or vapordeposition. Also illustrated by the cross-sectional view 1500 of FIG.15, a color filter 330 is formed buried in the passivation layer 328,and a micro-lens 332 is formed covering the color filter 330.

With reference to FIG. 16, a flowchart 1600 of some embodiments of amethod for manufacturing a BSI image sensor with a reflector isprovided.

While the method described by the flowcharts 1600 of FIG. 16 isillustrated and described herein as a series of acts or events, it willbe appreciated that the illustrated ordering of such acts or events arenot to be interpreted in a limiting sense. For example, some acts mayoccur in different orders and/or concurrently with other acts or eventsapart from those illustrated and/or described herein. Further, not allillustrated acts may be required to implement one or more aspects orembodiments of the description herein, and one or more of the actsdepicted herein may be carried out in one or more separate acts and/orphases.

At 1602, an ILD structure, a lower etch stop layer, and a hard masklayer are consecutively formed over a first surface of a substratehaving a photodetector. FIG. 6 illustrates some embodiments of across-sectional view 600 corresponding to act 1602.

At 1604, the hard mask layer is selectively patterned. FIG. 7illustrates some embodiments of a cross-sectional view 700 correspondingto act 1602.

At 1606, a reflector recess defined by a non-planar surface of the ILDstructure is formed to extend through the lower etch stop layer and intothe ILD structure at a position over a photodetector within thesubstrate. In some embodiments, the reflector recess may be formed usinga microtrenching etch process. FIG. 8 illustrates some embodiments of across-sectional view 800 corresponding to act 1606.

At 1608, a reflective material is formed in the reflector recess andover the lower etch stop layer. FIG. 9 illustrates some embodiments of across-sectional view 900 corresponding to act 1608.

At 1610, a planarization process is performed to form a reflector byremoving excess reflective material from over the lower etch stop layer.FIG. 10 illustrates some embodiments of a cross-sectional view 1000corresponding to act 1610.

At 1612, an upper etch stop layer is formed over the lower etch stoplayer and the reflector. FIG. 11 illustrates some embodiments of across-sectional view 1100 corresponding to act 1612.

At 1614, a first inter-metal dielectric (IMD) layer is formed over theupper etch stop layer. FIG. 12 illustrates some embodiments of across-sectional view 1300 corresponding to act 1614.

At 1616, a conductive interconnect wire is formed within the first IMDlayer. FIGS. 13-14 illustrate some embodiments of cross-sectional views1300-1400 corresponding to act 1616.

At 1618, a passivation layer, a color filter, a micro-lens, or acombination of the foregoing are formed on a second surface of thesubstrate that is opposite the first surface. FIG. 15 illustrates someembodiments of a cross-sectional view 1500 corresponding to act 1618.

Thus, as can be appreciated from above, in some embodiments, the presentdisclosure relates to a back-side illuminated complementary metal oxidesemiconductor image sensor (BSI-CIS) having a curved reflectorconfigured to provide for a high quantum efficiency and low crosstalk,and an associated method of formation.

In some embodiments, the present disclosure relates to an integratedchip. The integrated chip comprises an inter-layer dielectric (ILD)structure disposed along a first surface of a substrate having aphotodetector, and an etch stop layer over the ILD structure. Areflector is surrounded by the etch stop layer and the ILD structure.The reflector has a curved surface facing the substrate at a locationdirectly over the photodetector. The curved surface is coupled between afirst sidewall and a second sidewall of the reflector. The reflector haslarger thicknesses along the first sidewall and the second sidewall thanat a center of the reflector between the first sidewall and the secondsidewall

In other embodiments, the present disclosure relates to a method formanufacturing an image sensor. The method comprises forming aphotodetector within a substrate, forming a gate electrode over a firstsurface of the substrate, and forming an inter-layer dielectric (ILD)structure over the first surface of the substrate and the gateelectrode. The method further comprises forming a reflector recessextending into the ILD structure. The reflector recess is defined by ahorizontally extending non-planar lower surface of the ILD structure andsidewalls of the ILD structure. The method further comprises forming areflective material in the reflector recess, and performing aplanarization process to form a reflector by removing the reflectivematerial from over an uppermost surface of the ILD structure.

In yet other embodiments, the present disclosure relates to an imagesensor. The image sensor comprises a photodetector disposed within asubstrate, and a plurality of conductive interconnect layers arrangedwithin a dielectric structure disposed along a first surface of thesubstrate. A reflector is arranged directly over the photodetector andis separated from the substrate by the dielectric structure. A lineperpendicular to the first surface of the substrate bisects thereflector. A thickness of the reflector increases between the line andouter sidewalls of the reflector.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for manufacturing an image sensor, themethod comprising: forming a photodetector within a substrate; formingan inter-layer dielectric (ILD) structure over the substrate; forming amask over the ILD structure, wherein the mask defines an openingoverlying the photodetector and further defines a first sidewall segmentand a second sidewall segment in and respectively on opposite sides ofthe opening, wherein the ILD structure is uncovered by the maskcontinuously from the first sidewall segment to the second sidewallsegment; performing an etch into the ILD structure with the mask inplace to form a reflector recess extending into the ILD structure at theopening, wherein the ILD structure has a horizontally extendingnon-planar lower surface in the reflector recess after the etch; andforming a reflector filling and conforming to the reflector recess. 2.The method according to claim 1, wherein the etch is performed using amicrotrenching etch process.
 3. The method according to claim 2, whereinthe microtrenching etch process uses an etching gas chemistry comprisingoxygen and a fluorine species.
 4. The method according to claim 1,further comprising: forming an etch stop layer over the ILD structure,wherein the mask is formed over the etch stop layer, and wherein thereflector recess extends through the etch stop layer and is defined inpart by the etch stop layer.
 5. The method according to claim 1, whereinthe forming of the ILD structure comprises: depositing a first ILD layerover the substrate; and depositing a second ILD layer over and directlycontacting the first ILD layer, wherein the reflector recess iscompletely separated from the first ILD layer by the second ILD layer.6. The method according to claim 1, wherein a line perpendicular to atop surface of the substrate bisects the reflector, and wherein athickness of the reflector increases between the line and outersidewalls of the reflector.
 7. The method according to claim 6, whereina thickness of the reflector monotonically increases between the lineand the outer sidewalls of the reflector.
 8. The method according toclaim 1, wherein the reflector has a reflective surface facing thesubstrate and which is defined by a continuous function.
 9. A method forforming an image sensor, the method comprising: forming a photodetectorwithin a substrate; forming an inter-layer dielectric (ILD) structureover the substrate; depositing a first etch stop layer (ESL) over theILD structure; performing a first etch selectively into the first ESLand the ILD structure to form a first recess overlying thephotodetector, wherein the ILD structure defines a bottom surface of thefirst recess that has edges closer to the substrate than a center of thebottom surface; forming a reflector filling the first recess; depositingan inter-metal dielectric (IMD) layer over the first ESL and thereflector; and forming a wire in the IMD layer and the first ESL. 10.The method according to claim 9, further comprising: depositing a secondESL over and directly contacting the first ESL and the reflector,wherein the IMD layer is deposited over the second ESL, and wherein thewire is further formed in the second ESL.
 11. The method according toclaim 10, wherein the first and second ESLs are deposited as the samematerial.
 12. The method according to claim 9, wherein the forming ofthe wire comprises: performing a second etch selectively into the IMDlayer and the first ESL to form a second recess, wherein the ILDstructure defines a bottom surface of the second recess; and depositinga metal layer in the second recess and on a top surface of the IMDlayer; and performing a planarization into the metal layer to remove themetal layer from the top surface of the IMD layer.
 13. The methodaccording to claim 9, further comprising: forming a transistor overlyingthe substrate, wherein the ILD structure is formed over the transistor;and forming a contact via extending through the ILD structure to thetransistor, wherein the first ESL is deposited covering the contact via,and wherein wire is formed in direct contact with the contact via. 14.The method according to claim 9, further comprising: forming atransistor overlying the substrate, wherein the ILD structure is formedover the transistor; and forming a contact via extending through the ILDstructure, from the transistor to a top surface of the contact via thatfaces away from the substrate, and wherein the bottom surface of thefirst recess is closer to the substrate than the top surface of thecontact via.
 15. A method for forming an image sensor, the methodcomprising: forming a photodetector within a substrate; forming adielectric structure over the substrate; forming a mask over thedielectric structure, wherein the mask defines an opening overlying thephotodetector; performing an etch into the dielectric structure with themask in place to form a reflector recess extending into the dielectricstructure, wherein the etch has a higher etch rate at a periphery of theopening than that at a center of the opening; and forming a reflectorfilling and conforming to the reflector recess.
 16. The method accordingto claim 15, wherein the performing of the etch comprisesmicrotrenching.
 17. The method according to claim 15, wherein the etchis performed by a dry etch process in which ion to neutral radical fluxis large compared to reactive ion etching.
 18. The method according toclaim 15, wherein a portion of the dielectric structure at which thereflector recess is formed is uncovered by the mask when viewed inprofile.
 19. The method according to claim 15, further comprising:depositing an etch stop layer over the dielectric structure; anddepositing a hard mask layer over the etch stop layer, wherein the maskis formed over the hard mask layer, wherein the etch is performed intothe etch stop layer, the hard mask layer, and the dielectric structure,and wherein the hard mask layer is exposed in the opening laterally froma first side of the photodetector to a second side of the photodetectoropposite the first side.
 20. The method according to claim 15, furthercomprising: forming a contact via extending completely through thedielectric structure, wherein the etch terminates at a surface of thedielectric structure that is level with the contact via.